Chemical Industry Insights By Kunal

  Global Through Glass Via (TGV) Technology Market continues to witness robust expansion, with its valuation reaching USD 117 million in 2024 . According to comprehensive industry research, the market is projected to grow at an impressive CAGR of 23.8% , reaching approximately USD 507 million by 2032 . This rapid growth trajectory is primarily fueled by increasing adoption in 5G infrastructure, advanced semiconductor packaging, and high-performance computing applications, where TGV's superior electrical properties provide critical advantages over conventional solutions. Through Glass Via technology represents a groundbreaking approach to device miniaturization, enabling high-density vertical interconnects through ultra-thin glass substrates. Its ability to support signal transmission above 100 GHz with minimal loss (under 0.2 dB/mm) makes it particularly valuable for millimeter-wave applications. As industries transition toward heterogeneous integration and 3D packaging architect...